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Find out why PCB copper-clad laminate from the board surface
   Edit:   Browse:2055  Date:2014-06-10 
Signs: printed material poor adhesion, poor coating adhesion, some portions not etched away, and some portions can not be soldered.
Inspection methods may be employed: usually formed on the surface of the plate visible watermarks visual inspection:
Possible reasons: because they cause the release film is very dense and smooth surface, causing the copper surface is not too bright. Usually not clad laminate side, laminate manufacturers without removing the release agent. Pinhole copper foil, resulting in leakage of the resin and accumulates on the copper foil surface, which usually appear on weight specifications thinner than 3/4 ounce foil. The producer of copper excess antioxidant coated on copper foil surface. Laminate manufacturer changed the resin system, thin stripping, or brushing methods. Due to improper operation, there are a lot of fingerprints or grease. In punching, stained oil when cutting or drilling operations.

Possible solutions:
Manufacturers recommend using a fabric-like laminate film or other release material. And laminates maker contact, using mechanical or chemical removal method. And laminates maker contact, unqualified batch foil; request removal of resin Pa recommended solutions. Request a method for removing the laminate maker. Changtong recommend using hydrochloric acid, followed by mechanical grinding brush is removed. Before making any changes in manufacturing laminate, with the laminate manufacturer with, and require the pilot project.

Educate all staff wear gloves to take steps CCL. Indeed laminate clarify whether transportation or have the right pad of paper loaded bag and pad of paper low sulfur content, no dirt bag, be taken to ensure that no one is to touch when using detergent containing silicone copper before plating or before the pattern transfer process for all laminate degreasing.
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